ptctz..r....tt www.vishay.com vishay bccomponents revision: 21-may-13 1 document number: 29068 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 smd ptc thermistors for overload protection note (1) customized products are available on request features ? ideal for pick-and-p lace circuit assembly ? low mounting height ? suitable for reflow soldering ? small ceramic diameter for faster response ? low heat transfer to substrate ? flat terminations for stable positioning and good solderability ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 applications over-temperature/over-load protection: ? telecom - central office switching (c.o.) - subscriber terminal equipment (t.e.) - set-top box (s.b.) -modems - cable tv communications ? general industry and automotive - low power supplies overload protection - data bus protection description the component consists of a high-performance ptc ceramic disc mounted in a lead-frame fo r direct soldering onto a printed-circuit board (p cb) or substrate. ceramics are covered with a protective high temperature silicone layer. marking ? all smd ptcs are marked with a 3-digit type number (xxx) and a date code (yyww) note (2) these types pass itu-k20- 21-45 telecommunication pr otection recommendation quick reference data description value unit standard types (1) telecom types (1) nominal r 25 2 to 500 10 to 70 ? resistance tolerance 10; 15; 20 % maximum overload current ? (voltage dependent) 2 to 10 a non-trip current 50 to?500 (at 25 c) 50 to?100 (at 70 c) ma maximum voltage 16 to?400 220 to 600 v rms response time at 25 c ? and 20?w overload power < 1 s matching - down to 0.5 ? maximum continuous ? power at 25 c 2w electrical data and ordering information resistance matching ( ? ) v max. (v) i nt at i t at max. trip-time at 1 a (s) i max. at v max. (a) catalog number r 25 ( ? ) tol. (%) 25 ? c (ma) 70 ? c (ma) 25 ? c (ma) sap ordering code type nr marking telecommunication types 10 20 no 245 165 100 270 3.0 2.0 ptctz3nr100gtt (2) 012 10 20 0.5? 245 165 100 270 3.0 2.0 ptctz3mr100gtt (2) 016 40 25 no 265 80 50 130 0.8 2.0 ptctz3nr400htt 002 25 20 1? 265 120 70 220 1.3 2.0 ptctz3mr250htt (2) 005 15?to?20 - no 300 150 100 250 1.5 1.5 ptctz3nr150ktt (2) 004 15?to?20 - 0.5? 300 150 100 250 1.5 2.0 ptctz3mr150ktt (2) 003 20 20 0.5? 300 120 70 250 1.4 1.5 ptctz3mr200ktt (2) 018 35 + 15/- 20 1? 425 110 70 175 1.0 0.7 ptctz3mr350mtt (2) 009 50 20 1? 425 90 60 150 0.8 0.7 ptctz3mr500mtt 019 general industrial types 3.3 25 - 24 400 - 650 6.0 8.0 ptctz3nr339ctt (2) 013 9.4 25 - 60 150 100 300 1.8 3.0 ptctz3nr949ett (2) 011
ptctz..r....tt www.vishay.com vishay bccomponents revision: 21-may-13 2 document number: 29068 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ptc outlines dimensions in millimeters dimensions of solder lands in millimeters soldering conditions this smd thermistor is only suitable for reflow soldering, in accordance wi th jedec j-std-020d . soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. th e maximum temperature of 260 c during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. typical examples of a soldering processes that will pr ovide reliable joints withou t damage, are shown below. handling precautions the special leadframe construction and the applied processes do not allow high handling forces on the component. because of the nature of ptc ceramic ma terial the component should not be touc hed with bare hand s, as the residue of perspiration can infl uence component behaviou r at high temperatures. handling forces vertically applied to the ce ntre of the component should be limited to 5 n in the non-soldered condition and to 10 n in the soldered. these forces should not be exceeded during the handling, transportation and packaging of the soldered product. ptc smd cerami c size: 6.5 mm 3.6 0.1 10 0.25 8.0 2.8 2 4 0.1 4 0.2 0.2 10 max. 1 7.6 0.25 3.45 0.15 1.2 7.2 0 - 0.2 0.6 + 0.6 0 3 2 2 3 1 material information ref. description material and remarks 1 ceramic batio 3 doped 2 metallization nicr ag layer (vacuum deposition) 3leadframe ni plated phosphor bronze material covered by matte tin layer 11 5 2 0 50 100 150 200 250 300 250 200 150 100 50 0 t (s) 215 c 180 c 20 s to 40 s internal preheating, e.g. by infrared, max. 2 k/s 100 c 130 c external preheating forced cooling t (c) typical values (solid line) process limits (dotted lines) vapour phase soldering reflow soldering 0 50 100 150 200 250 300 250 200 150 100 50 0 10 s 260 c t (s) 215 c 180 c 10 s 40 s 2 k/s t (c) 245 c 130 c typical values (solid line) process limits (dotted lines)
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